超薄芯片卷拉-顶推剥离力学分析与对比研究
史柯文, 孔子文, 吕文瀚, 陈思宇
Mechanical Analysis and Comparative Study of Ultra-Thin Chip Stretching-Ejecting Peeling Process
SHI Kewen, KONG Ziwen, LYU Wenhan, CHEN Siyu
力学季刊
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2025, (3): 570
-585
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DOI: 10.15959/j.cnki.0254-0053.2025.03.002
