IGBT模块封装中大面积基板连接的应力翘曲分析
丰王健，李欣
Stress and Warping Analysis of Large Area Substrate Connection in IGBT Module Package
FENG Wangjian, LI Xin
力学季刊 . 2020, (1): 59 -068 .  DOI: 10.15959/j.cnki.0254-0053.2020.01.006