Electromigration Stress Analysis of Copper Interconnects Considering Strain Energy Density

LIU Qing, XU Kai-Yu

Chinese Quarterly of Mechanics ›› 2017, Vol. 38 ›› Issue (2) : 359-368.

Chinese Quarterly of Mechanics ›› 2017, Vol. 38 ›› Issue (2) : 359-368. DOI: 10.15959/j.cnki.0254-0053.2017.02.019

Electromigration Stress Analysis of Copper Interconnects Considering Strain Energy Density

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 38(2): 359-368 https://doi.org/10.15959/j.cnki.0254-0053.2017.02.019

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉