Stress and Warping Analysis of Large Area Substrate Connection in IGBT Module Package

FENG Wangjian, LI Xin

Chinese Quarterly of Mechanics ›› 2020, Vol. 41 ›› Issue (1) : 59-068.

Chinese Quarterly of Mechanics ›› 2020, Vol. 41 ›› Issue (1) : 59-068. DOI: 10.15959/j.cnki.0254-0053.2020.01.006

Stress and Warping Analysis of Large Area Substrate Connection in IGBT Module Package

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 41(1): 59-068 https://doi.org/10.15959/j.cnki.0254-0053.2020.01.006

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