New Simplified Model and Fatigue Life Analysis of Flip Chip Welding for High Density Packaging

CUI Xinyu, SHAN Yuehui, SHEN Fei, KE Liaoliang, SU Jie

Chinese Quarterly of Mechanics ›› 2023, Vol. 44 ›› Issue (1) : 65-74.

Chinese Quarterly of Mechanics ›› 2023, Vol. 44 ›› Issue (1) : 65-74. DOI: 10.15959/j.cnki.0254-0053.2023.01.007

New Simplified Model and Fatigue Life Analysis of Flip Chip Welding for High Density Packaging

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 44(1): 65-74 https://doi.org/10.15959/j.cnki.0254-0053.2023.01.007

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉