Mechanical Analysis and Comparative Study of Ultra-Thin Chip Stretching-Ejecting Peeling Process

SHI Kewen, KONG Ziwen, LYU Wenhan, CHEN Siyu

Chinese Quarterly of Mechanics ›› 2025, Vol. 46 ›› Issue (3) : 570-585.

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Chinese Quarterly of Mechanics ›› 2025, Vol. 46 ›› Issue (3) : 570-585. DOI: 10.15959/j.cnki.0254-0053.2025.03.002

Mechanical Analysis and Comparative Study of Ultra-Thin Chip Stretching-Ejecting Peeling Process

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 46(3): 570-585 https://doi.org/10.15959/j.cnki.0254-0053.2025.03.002

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