Efficient Modeling of Curing Process-Induced Warpage in Composites Using Solid-Shell Elements

DONG Yiqing, CAO Han, YAO Lei, DONG Changrong, FAN Xinyu, REN Jiannan, ZHI Jie, YANG Weidong, LI Yan

Chinese Quarterly of Mechanics ›› 2026, Vol. 47 ›› Issue (3) : 534-543.

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Chinese Quarterly of Mechanics ›› 2026, Vol. 47 ›› Issue (3) : 534-543. DOI: 10.15959/j.cnki.0254-0053.2026.03.005

Efficient Modeling of Curing Process-Induced Warpage in Composites Using Solid-Shell Elements

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 47(3): 534-543 https://doi.org/10.15959/j.cnki.0254-0053.2026.03.005

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