Mechanical Analysis and Comparative Study of Ultra-Thin Chip Stretching-Ejecting Peeling Process
SHI Kewen, KONG Ziwen, LYU Wenhan, CHEN Siyu
Chinese Quarterly of Mechanics . 2025, (3): 570 -585 .  DOI: 10.15959/j.cnki.0254-0053.2025.03.002