New Simplified Model and Fatigue Life Analysis of Flip Chip Welding for High Density Packaging
CUI Xinyu, SHAN Yuehui, SHEN Fei, KE Liaoliang, SU Jie
Chinese Quarterly of Mechanics . 2023, (1): 65 -74 .  DOI: 10.15959/j.cnki.0254-0053.2023.01.007